1. Sehlahisoa sa Sehlahisoa
Corrugated Graphite Tape High Recovery ke sesebelisoa se sebetsang se entsoeng ka{0}}purity flake graphite e phahameng (purity E kholo ho feta kapa e lekana le 99.9%) ka ho roala, ho etsoa ka masenke, le ka mokhoa o khethehileng oa rekere. Boleng ba eona bo ka sehloohong bo ho "bancing high elasticity rebound le thermal conductivity/sealing properties of graphite", ho rarolla lintlha tse bohloko tsa lihlahisoa tsa setso tsa graphite tse kang brittleness le rebound e futsanehileng, 'me e loketse ho tiisa ka matla le maemo a fetohang a mocheso oa mocheso.
2. Teknoloji Parameters
|
Ntho ea parameter |
Lethathamo la Lipontšo |
Tekanyetso ea Teko |
|
Bohloeki ba Graphite |
E kholo ho feta kapa e lekana le 99.9% |
GB/T 3521-2021 |
|
Botenya Range |
0.1-5.0mm (e ka khonahala) |
ISO 4593 |
|
Bophara Range |
5-1000mm (ka tloaelo) |
ISO 4593 |
|
Botenya |
1.8-2.1 g/cm³ |
GB/T 20495-2021 |
|
Compression Ratio (2MPa) |
20%-50% |
ASTM F36 |
|
Rebound Rate (kamora ho laolla) |
E kholo ho feta kapa e lekana le 85% |
ASTM F36 |
|
Longitudinal Thermal Conductivity |
150-300 W/(m·K) |
ASTM D5470 |
|
Lateral Thermal Conductivity |
50-100 W/(m·K) |
ASTM D5470 |
|
Temperature Resistance Range (Tikoloho ea Moea) |
-150 likhato ~ 450 likhato |
Tlhaloso: IEC 60068-2-14 |
|
Matla a tšepe |
E kholo ho feta kapa e lekana le 15 MPa |
GB/T 1040.4-2006 |
|
Corrosion Resistance (Ho qoelisoa ka lihora tse 24) |
Tahlehelo ea Boleng e Ka tlase ho kapa e lekanang le 0.5% |
GB/T 1033.1-2008 |
Likarolo tsa 3.Core
(1) Elasticity e Ntle le Ts'ebetso ea Rebound
Moralo oa sebopeho sa masenke o etsa hore sehlahisoa se fihlelle sekhahla sa khatello ea 20% -50% (tlas'a khatello ea 2MPa), ka sekhahla sa ho khutla se seholo ho feta kapa se lekanang le 85% kamora ho laolla. E ka boloka khatello ea ho tiisa / ea mocheso nako e telele, ho qoba ho hlōleha ho bakoang ke ho sisinyeha kapa ho atolosoa ha mocheso le ho fokotseha.
(2) E babatsehang Thermal Conductivity le Mocheso Resistance
Longitudinal conductivity thermal conductivity ea 150-300 W/(m·K), transverse thermal conductivity of 50-100 W/(m·K); mocheso oa ho hanyetsa mocheso o fapaneng -200℃~ 600℃(tikoloho e sa sebetseng), -150℃~ 450℃(tikoloho ea moea), e ka mamella ho fetoha ha mocheso o feteletseng.
(3) Botsitso ba Lik'hemik'hale le Ho hanyetsa Corrosion
Acid le alkali resistant (concentration Ka tlase kapa e lekanang le 30% H₂SO₄, E ka tlaase ho kapa e lekanang le 20% NaOH), e hanyetsanang le li-solvents (ethanol, acetone, joalo-joalo), ha e sebetsane le mecha ea litaba ea indasteri, e loketseng libaka tse senyang tse kang lik'hemik'hale le liindasteri tse ncha tsa matla.
(4)Easy Processing le Adaptability
Corrugated Graphite Tape High Recovery e ka khaoloa ka boholo bofe kapa bofe ho latela litlhoko (bophara ba 5-1000mm, botenya ba 0.1-5.0mm), e ts'ehetsa ho etsoa ha setempe, 'me e loketse libaka tse tiisitsoeng tse sa tsitsang kapa li-interfaces tsa mocheso.
4.Morero o Moholo
|
Sebaka sa Kopo |
Specific Scenario |
|
Indasteri ea Boitsebiso ba Elektronike |
Chip/CPU flexible thermal pad, sehokelo sa ho lahla mocheso oa mabone a LED, lisebelisoa tsa 5G setsing sa lisebelisoa tsa taolo ea mocheso. |
|
Indasteri e Ncha ea Matla |
Betri ea matla PACK e tiisang likarolo tse tsamaisang mocheso, ho tlatsa lekhalo la betri ea polokelo ea matla, hydrogen fuel cell bipolar plate sealing |
|
Tšimo ea ho Tiisa Liindasteri |
-valve e phahameng ea mocheso/flange seal, compressor piston rod seal, flexible seal at pipeline interface |
|
Sebaka sa Aerospace |
Spacecraft{0}}karolo e thibelang mocheso o phahameng{0}e thibelang mocheso oa mocheso, mats'eliso a lekhalo la lisebelisoa tsa satellite tsa thermal control gap |
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