Filimi ea Graphite Thin

• Graphite Thin Film ke{0}}sebelisoa sa khabone{1}e thehiloeng holimo{1}e hlahisoang ke{2}}mocheso o phahameng oa graphitization le almanaka e tsoelang pele. E sebetsa e le taolo ea mantlha ea mocheso le tharollo ea tšireletso ea motlakase bakeng sa lisebelisoa tsa sejoale-joale tsa elektroniki, matla a macha le lisebelisoa tse nepahetseng.

• Sehlahisoa sena se etselitsoe ho rarolla ho bokellana ha mocheso le ho kena-kenana le motlakase ho-lisebelisoa tse hokahaneng tse phahameng. E na le sebopeho se phethahetseng sa kristale ea graphite, e fana ka -ho sebetsa hantle ha mocheso oa sefofane le ts'ebetso e tšepahalang ea motlakase, e netefatsa ts'ebetso e tsitsitseng ea likarolo tsa mantlha tlas'a mojaro o phahameng.

Tlhokomeliso: Sehlahisoa se tšehetsa ho itloaetsa

• Pheliso ea mocheso oa lisebelisoa tsa elektroniki tsa bareki: Li-smartphone/tablet/ultra{0}}lilaptop tse tšesaane - li sebelisa li-backplates tsa CPU/GPU/betri e le lisebelisoa tsa ho futhumatsa mocheso ho batalatsa libaka tsa lehae le ho nkela foil e 'ngoe ea koporo. Botenya hangata ke 0.025-0.1mm bakeng sa PGS ea maiketsetso, 'me 0.1-0.2mm bakeng sa foil ea tlhaho ea graphite e boetse e sebelisoa bohareng ba mechine e tlaase.
• Wearable/VR/AR - Bend zone conductive layer, o sebelisa matsoelintsoeke a bonolo ntle le ho peperana.
• Lebone la LED/LCD - Lifaha tsa LED tse tšehelitsoeng ka thermal conductive, tse atisang ho etsoa ka filimi ea tlhaho ea graphite ea 0.1-0.2mm.

• Matla a phahameng le lisebelisoa tsa puisano: 5G base station PA amplifier RRU, Optical module - filimi e tšesaane ea graphite e sebelisetsoa ho futhumatsa lisebelisoa tsa RF ka mokhoa o ts'oanang, ho rarolla bothata ba ho senya mocheso o fokolang o otlolohileng le o ka ntle ka har'a libaka tse koetsoeng.
• Seva ea AI/HPC/setsi sa data - IGBT, module ea SiC, karete ea boto ea GPU e nang le filimi ea graphite e nang le mocheso o phahameng oa mocheso, hot spot cooling 8-25℃.
• EV battery pack le motlakase oa koloi - insulation le ho leka-lekanya mocheso pakeng tsa lisele tsa betri, OBC/DC-DC module TIM auxiliary layer, BMS circuit board heat dissipation; Ka nako e ts'oanang le ts'ireletso e nyane ea EMI.

• Ho tiisoa ha indasteri le maemo a mocheso o phahameng: 0.1-0.5mm foil ea tlhaho ea graphite e tšesaane - lesale la packing le se nang letho, lesela le tšesaane la flange, gasket e koahelang pompo, sekepe sa graphite boat sintered isolation gasket (e hanana le 450℃oxidation/3000 inertness).
• E ka kengoa ka har'a Ø 10mm hollow tubes - ka thata e ntle, conductivity e ntle, le 0.1-0.2mm roll tubes, tse tsamaellanang le{4}}hloekile ea tlhaho ea graphite foil e tshesane e sebelisoang joalo ka matsoho a futhumatsang a motlakase/anti-static lining tubes/sensor protection tubes, eseng haholo-holo molemong oa ho koala.

• Conductivity and electromagnetic function: EMI shielding liner - graphite film with in-plane conductivity (resistivity 3-10 μ Ω· m), e kentsoeng ka khetla ea polasetiki kapa foreimi e bohareng bakeng sa ho sireletsa.
• Flexible heat element - low voltage powered self heat, sebediswa bakeng sa kalafo ya thermal e ka rwalwang, aircraft de icing, matsoho a ho futhumatsa sebopi sa laboratori (a phutholletsweng ka hara ditupu ho etsa dipeipi tsa ho futhumatsa).
• Conductive filler substrate/e tšehetsa moqokelli oa hajoale - lithium battery negative electrode corner material e hatelitsoeng, flow battery electrode linening.

• Aerospace/Semiconductor: satellite electronic module equalization, wafer equipment sputtering chamber insulation line, rocket nozzle thermal protection (PGS level).

• Khampani e fetisitse tsamaiso ea tsamaiso ea boleng ba ISO9001 le setifikeiti sa tsamaiso ea tikoloho ea ISO14001, e bonts'a sepheo sa eona se hlahelletseng sa taolo ea boleng le tlhahiso ea tikoloho. Re na le mahlale a 9 a nang le tokelo ea molao a koahelang likarolo tsa bohlokoa joalo ka ts'ebetso ea ho lokisa thepa ea graphite le ntlafatso ea ts'ebetso ea sehlahisoa, e fanang ka ts'ehetso e matla bakeng sa tlholisano ea lihlahisoa tsa k'hamphani.

Ha re baetsi feela, empa hape ke bafani ba litharollo tse akaretsang, ho ntlafatsa meralo e ipapisitseng le litšobotsi tsa liindasteri tsa setso ho fihlela tlhahiso e phethahetseng ea indasteri.

• Tiisetso ya Tshebeletso

1. Taolo ea ts'ebetso: Ho nepahala ha rolling ± 0.01mm, phoso ea ho itšeha Ka tlase ho kapa ho lekana le 0.5mm, ho netefatsa ho nepahala ha sehlahisoa se phahameng. Lisebelisoa tse tsoetseng pele tsa tlhahiso le litsamaiso tsa taolo ea boiketsetso li sebelisoa ho fihlela taolo e nepahetseng ea mekhoa ea tlhahiso

2. Tsamaiso e ikhethileng: Theha mokhoa oa 4 oa hora ea Root Cause Analysis (RCA) ho arabela ka potlako litabeng tsa boleng le ho nka mehato ea ho lokisa ka nako e loketseng. Ngola le ho sekaseka maemo a sa tloaelehang ka botlalo, akaretsa lithuto tseo u ithutileng tsona, 'me u thibele mathata a tšoanang ho etsahala hape.

3. Ntlafatso e tsoelang pele: Sekhahla sa selemo le selemo sa litletlebo tsa bareki se ka tlase ho 0.3%. Ka maikutlo a bareki, re tsoela pele ho ntlafatsa boleng ba sehlahisoa le maemo a litšebeletso, khafetsa re etsa mesebetsi ea ntlafatso ea boleng, re ntlafatsa ts'ebetso ea tlhahiso, le ho ntlafatsa ts'ebetso ea sehlahisoa le botsitso ba boleng.

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